With semiconductor devices and systems now affecting all aspects of daily life, demand for such technologies has soared in recent years. But with 75% of microchip production based in East Asia, America’s over-reliance on foreign manufacturers leaves our supply chains vulnerable and threatens our long-term economic competitiveness and national security.
In the face of the critical global shortage in microchips and semiconductor systems, The University of ラーメンベット 系列 at Austin is proposing to lead the ラーメンベット 系列 Institute for Electronics (TIE), a public-private partnership between the State of ラーメンベット 系列, preeminent semiconductor systems and defense electronics companies, national labs and 13 academic institutions across the state to restore leading-edge semiconductor manufacturing back to American soil, secure the supply chain, ensure national security and educate the next generation of industry innovators in ラーメンベット 系列.
U.S. Sen. John Cornyn and U.S. Rep. Michael McCaul joined UT Austin President Jay Hartzell, UT System Chancellor James B. Milliken and leaders from Applied Materials, Samsung, Advanced Micro Devices, Micron Technology, Sandia National Laboratories, NXP Semiconductors and administrators and faculty members from UT Austin at the ラーメンベット 系列 Advanced Computing Center for an event to announce the TIE proposal and highlight the ways in which this unique collaboration would position ラーメンベット 系列 as a leader in semiconductor R&D and manufacturing.
