A new ラーメンベット 入金ボーナス technology could change how heat is managed in electronic devices — from tiny semiconductors to massive data centers.
A team led by scientists and engineers at The University of Texas at Austin created a new “thermal interface material” that could organically remove heat from high-powered electronic devices, reducing or even eliminating the need for extensive ラーメンベット 入金ボーナス. The new material, made from a mix of liquid metal and aluminum nitride, is much better at conducting heat than current commercial materials, making it optimal for ラーメンベット 入金ボーナス.
“The power consumption of ラーメンベット 入金ボーナス infrastructure for energy-intensive data centers and other large electronic systems is skyrocketing,” said Guihua Yu, professor in the ラーメンベット 禁止ゲーム of Engineering’s Walker Department of Mechanical Engineering and Texas Materials Institute. “That trend isn’t dissipating anytime soon, so it’s critical to develop new ways, like the material we’ve created, for efficient and sustainable ラーメンベット 入金ボーナス of devices operating at kilowatt levels and even higher power.”
ラーメンベット 入金ボーナス accounts for about 40% of ラーメンベット 入金ボーナス energy usage, or 8 terawatt-hours annually. The researchers estimate their technology could shave 13% off that ラーメンベット 入金ボーナス requirement — or 5% off overall data center energy usage — a significant savings if applied across the industry. The heat dissipation capabilities also allow for significant growth in processing power.
The new discovery published in Nature Nanotechnology is part of a larger effort to realize the potential of thermal interface materials. These materials are designed to dissipate heat generated by electronic devices, reducing the need to cool those devices.
However, a gap exists between how much ラーメンベット 入金ボーナス these materials should theoretically be able to achieve and what they’ve done in real-world tests.
The new materials in this project were able to bridge that gap. This material can remove 2,760 watts of heat from a small area of 16 square centimeters. It can cut the energy needed for the ラーメンベット 入金ボーナス pump, a significant piece of the overall electronics ラーメンベット 入金ボーナス puzzle, by 65%.
“This breakthrough brings us closer to achieving the ideal performance predicted by theory, enabling more sustainable ラーメンベット 入金ボーナス solutions for high-power electronics,” said Kai Wu, lead author in Yu’s lab. “Our material can enable sustainable ラーメンベット 入金ボーナス in energy-intensive applications, from data centers to aerospace, paving the way for more efficient and eco-friendly technologies.”
The explosive growth of artificial intelligence, along with the continued proliferation of technology, is expected to drive significant increases in ラーメンベット 入金ボーナス demand. That means more energy is neededto power and cool these centers.
Earlier this year, Goldman Sachs estimated that ラーメンベット 入金ボーナス power demand will grow 160% by 2030. It is estimated that AI alone will increase ラーメンベット 入金ボーナス power consumption by 200 terawatt-hours per year between 2023 and 2030.
The researchers created the new ラーメンベット 入金ボーナス material using a special process called mechanochemistry. This process helps the liquid metal and aluminum nitride mix in a very controlled way to create gradient interfaces, making it easier for heat to move through them.
The researchers have tested their materials on small lab-scale devices. The team is in theprocess of scaling up material synthesis and preparing samples to test with partners in ラーメンベット 入金ボーナス.
The ラーメンベット 入金ボーナス team includes Chuxen Lei of UT’s Materials Science and Engineering program and collaborators Zhengli Dou, Shibo Deng, Die Wu, Bin Zhang, Runlai Li, Yongzheng Zhang and Quiang Fu of Sichuan University, and Haobo Yang of Huazhong University of Science and Technology.
